Rockwell Collins Selected for ‘Tin Whiskers’ Mitigation Research
CEDAR RAPIDS, IA – Rockwell Collins has been awarded a research contract from the Department of Defense's Strategic Environmental Research and Development Program for the Tin Whiskers Inorganic Coatings Evaluation (TWICE) program. This research has the potential to mitigate the impact of tin whiskers on high-reliability, high-performance electronic systems caused by new lead-free alloys and finishes in the aerospace and defense supply chain and manufacturing systems.
The transition to lead-free electronics has changed some of the ground rules for designing reliable electronics for use in harsh environments. One of the most significant changes has been the need to address the phenomenon of tin whiskers, which can grow from the pure tin surfaces commonly used on lead-free devices. Tin whiskers are microscopic metal fibers that are thinner than a human hair capable of bridging great distances that can create short-circuits leading to equipment failures.