Nanodiamonds in Thermally Conductive Polymer Improve Performance
VANTAA, Finland – Carbodeon has developed a thermal filler using nanodiamonds that increases the conductivity of thermally conductive polymers by 25 percent, providing significant performance increases for polymers used in electronics and LED manufacturing.
Starting with a polyamide 66 (PA66) reference material containing 45 percent by weight of boron nitride as the thermal filler, Carbodeon created a new material using 44.9 percent boron nitride and 0.1 percent of its uDiamond® nanodiamond powder. The thermal conductivity of the PA66 increased by 25 percent, averaged across all planes.