Deadline Approaches for UV/EB Technical Conference
July 19, 2009
BETHESDA, MD - Participants planning to submit an abstract for the RadTech UV & EB Technical Conference 2010, taking place in Baltimore, MD, must submit their abstract by July 31, 2009.
The RadTech Technical Conference is the global platform for the newest developments in the UV and EB curing industry, presenting new applications and solutions to the global manufacturing community. Innovations in the following industries are traditionally highlighted: printing and packaging, wood finishing, metal and plastics, industrial coatings, electronics, aerospace and defense, automotive OEM, and refinish/body repair. New areas of interest will include concrete floor coatings, photovoltaics, and several other areas driven by the need for energy reduction and economical and sustainable solutions for ink, coating, adhesive, and resin curing.
For more details and to submit an abstract, visit www.radtech2010.com/callforpapers.html. The website for the event is www.RadTech2010.com.