Ferro Corp.’s Electronic Material Systems business has advanced its chemical mechanical planarization (CMP) technology with two slurries that enable high-yield processing of 65 nanometer and 45 nanometer node electronic devices.
Ferro Corp.’s Electronic Material Systems business has advanced its chemical mechanical planarization (CMP) technology with two slurries that enable high-yield processing of 65 nanometer and 45 nanometer node electronic devices. The products reportedly have been proven in the commercial manufacturing of microelectronics. CMP is a required process for manufacturing advanced integrated circuits. Ferro's new CMP slurries are designed to precisely plane silicon wafers to a uniform surface, enabling stacking of multifunctional layers that support smaller, faster, more energy-efficient microprocessors, memory chips with greater storage capacity, and lighter devices for mobile applications.
One of the new products, TruPlane™8272, is performing successfully in high-volume manufacturing of 65 nanometer node Flash devices, and Ferro is supplying slurries for 45 nanometer node STI logic devices. The other new product is SureStop™ 8500, a patent-pending self-stopping CMP slurry for inner layer dielectric (ILD) materials that offers improved efficiency and uniformity with lower defectivity compared to standard slurries. Formulated with Ferro's optimized ceria particles and proprietary additives, SureStop 8500 contains chemistries that automatically stop polishing when the topography has been removed. According to the company, the product saves time and cost relative to standard ILD slurries and is now being used to simplify certain multi-step planarization processes.
For more information, call 216.875.7155 or visitwww.ferro.com.
Ferro Introduces New CMP Slurries - Posted 6/20/07
June 20, 2007