Kevin Biller combines his love of food and cooking with his years of knowledge in researching, developing and testing powder coatings.

Semiconductor packaging assemblies require immense durability to protect the finished device from heat, physical impact, warping, static electricity and moisture. Therefore, formulators of epoxy compounds for semiconductor packaging assemblies require epoxy resins that deliver multiple performance characteristics that are dependent upon the requirements of the application or location of the finished device.

This novel water-based epoxy system, which offers comparable performance to traditional solventborne epoxy/polyamide systems, can also be applied on civil engineering concrete substrates, and has a lower applied cost.

BASF and Gustav Grolman GmbH & Co. KG have strengthened their exclusive collaboration in Europe in the marketing of amine-based curing agents for the processing of epoxy resins, with immediate effect.

Functionalized, discrete carbon nanotubes have been made that provide significant improvements in the durability of epoxies.

By using an epoxy curing blanket you can cure and post cure your epoxy at whatever temperature it requires, even if that temperature is really high.