The multi-wavelength feature, in maskless lithography for manufacturing printed circuit boards, supports many photoresists ranging from general-purpose dry film to conventional solder mask. For pre-press operations in the printing industry, computer-to-plate systems with UV-LED can support highly cost-efficient, mature UV-plate technology.  In computer-to-screen printing, UV LED and DLP exposure eliminates the need for several consumables and production steps improving process efficiency at lower cost with higher quality.

The 3300B series features a UV-LED array coupled to a high efficiency, non-imaging collection optic with an aspect ratio matched to DLP chips. An integral imaging optic is telecentric over the entire DLP and is constrained in angle to match the micromirror tilt angle. Water-cooling allows the UV-LED array to be operated at a very high current density. The result is an extremely high power, highly uniform UV-LED illuminator, which provides unprecedented speed and resolution for UV DLP applications.

Up to an 18-die UV-LED array can be integrated into the 3300B series, which can be driven and modulated independently for precise exposure control in direct imaging systems. Innovations in Optics has also developed an OEM driver with Ethernet and serial control to support this feature. The driver provides independent current control to each of the LED die to achieve optimal performance and lifetime. Thermal management in the 3300B series includes a water heat exchanger for cooling of the LED array, and an onboard thermistor for temperature monitoring. In addition to multi-wavelength, other user options include a selection of non-imaging collection optics to match various DMD sizes, up to two photodetectors with optional integral spectral bandpass filters for feedback control or exposure monitoring, fixed or adjustable mounting flanges, and straight or right-angle hose barbs for the water heat exchanger.

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