BETHESDA, MD - RadTech has announced the UV+EB Packaging Conference, a one-day event in Philadelphia on October 24, 2017. At the conference, RadTech will host presentations on migration, regulatory issues and the latest developments in UV+EB curable inks, coatings, and adhesives for food and consumer goods packaging.
RadTech is also hosting the RadTech Fall Member Meeting on October 25, 2017, the day after the UV+EB Packaging Conference. The events will take place at the DoubleTree by Hilton Philadelphia Airport.
If you have a topic you would like to see discussed at the UV+EB Packaging Conference, contact Mickey Fortune at 240/643.0517.
For additional information about the conference and meeting, visit http://www.radtech.org.
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