SUSS and Manz Asia have entered into a strategic collaboration to develop next-generation inkjet systems for semiconductor manufacturing and advanced packaging.

SUSS will contribute semiconductor process-equipment and advanced-packaging expertise, while Manz Asia will provide inkjet technology, manufacturing engineering and experience in panel-level packaging.

The companies plan to explore new inkjet applications, validate materials and processes and develop manufacturing approaches capable of moving from process development into higher-volume semiconductor production.

Inkjet technology allows manufacturers to deposit materials selectively rather than coating an entire surface. SUSS said the approach can reduce material consumption, improve cost efficiency and provide uniform deposition on complex three-dimensional structures. Those benefits are company-described expectations.

Panel-level packaging will be a central focus of the collaboration. The companies said increasing package size and complexity are creating demand for greater process flexibility, material efficiency and manufacturing scalability.

SUSS expects inkjet to become a more important part of its coating business. The company cited market assessments estimating that the annual serviceable equipment market for semiconductor inkjet applications could exceed $800 million by 2030. That figure is a company-cited market forecast.

No commercial system, named customer, development timetable or production installation was announced.

Primary source: SUSS and Manz Asia’s collaboration announcement

Supporting company-issued source: Manz Asia’s announcement

The collaboration is relevant to PCI readers following application equipment and selective digital-deposition processes for complex functional materials.