RadTech UV/EB Technology Conference & Expo 2008, held May 4-7 at Lakeside Center at McCormick Place, Chicago, IL, will feature an end user conference alongside its regular technical conference and exhibition. Topics addressed on Monday, May 5, will include UV wood finishing and building applications; developments in UV curing for automotive OEM, Tier One and refinish applications; UV & EB technology for aerospace and defense applications; and UV & EB for direct food contact packaging.
On Tuesday, May 6, the end user conference will address UV & EB curing for sustainable printing and packaging; UV curing for industrial applications; and EH&S considerations for the end user.
For more information about the end user conference, technical conference or exhibition, visitwww.uveb2008.com.
RadTech UV/EB 2008 to Feature End User Conference - Posted 4/10/08
April 10, 2008