CHICAGO – UV and EB technologies used across the spectrum of U.S. manufacturing were the focus of RadTech UV & EB Technology Expo & Conference, which took place April 30-May 2, 2012, in Chicago. The event featured technical conference presentations, eight end-user sessions and 77 exhibitors. Session topics included Graphic Arts; Barrier Coatings and Conductive Films for Flexible Electronics; Harsh Environments − Corrosion, Weathering and Exterior; Nanomaterials; LEDs; Rapid Field Applied; and Stereolithography. 

Stephen P. Klump, Nestlé Quality Assurance Center, headlined a special day of presentations on the fast emergence of UV and EB technologies in printing and packaging applications. Klump addressed Nestlé’s Approach to Packaging Safety and Compliance: Nestlé Inks Guidance Document and the Suisse Ordinance on Inks.

The RadTech Emerging Technology Committee recognized innovative companies that utilize UV and EB technologies with the Emerging Technology Awards. UniPixel Inc, The Woodlands, TX, was recognized for conductive film that is manufactured using a low-cost, UV-curable, transparent roll-to-roll process by micro and nano-embossing. Interprint NA, Pittsfield, MA, was honored for EB coatings for decorative laminates on film substrates. And HRL Laboratories LLC, Malibu, CA, was recognized for UV used to make the world’s lightest structure.