RadTech 2012 Explores UV and EB Technologies in Manufacturing
CHICAGO – UV and EB technologies used across the spectrum of U.S. manufacturing were the focus of RadTech UV & EB Technology Expo & Conference, which took place April 30-May 2, 2012, in Chicago. The event featured technical conference presentations, eight end-user sessions and 77 exhibitors. Session topics included Graphic Arts; Barrier Coatings and Conductive Films for Flexible Electronics; Harsh Environments − Corrosion, Weathering and Exterior; Nanomaterials; LEDs; Rapid Field Applied; and Stereolithography.
Stephen P. Klump, Nestlé Quality Assurance Center, headlined a special day of presentations on the fast emergence of UV and EB technologies in printing and packaging applications. Klump addressed Nestlé’s Approach to Packaging Safety and Compliance: Nestlé Inks Guidance Document and the Suisse Ordinance on Inks.