Innovations in Optics Inc. has introduced boards for high-power UV LED applications such as UV curing, 3D printing, maskless lithography, photodynamic therapy, and fluorescence excitation in life science or machine vision. The boards offer maximized heat and current spreading to deliver high UV optical power with superior thermal management and open platform flexibility that provides for totally unique and compact UV LED design solutions.
They utilize chip-on-board LED technology with metallic core PCB substrates that feature a large emitting area using a closely packed array of UV LED chips. Standard center wavelengths include 365 nm, 385 nm, 395 nm and 405 nm. The 1.1 mm square LED die can be PCB mounted as a single chip or in arrays up to 4 by 4 chips to provide 19.4 mm2 of source area. Each die can be driven to emit near 2W/mm2, therefore a 16-die array can supply close to 40 watts of UV optical power.