DAVENPORT, IA – Specialty coatings manufacturer ACTEGA Kelstar is participating in the upcoming “EB Benefits in Packaging” series of seminars that begin this fall.

Targeting flexible packaging producers, label printers, folding carton converters and brand owners, this one-day event will provide an overview of electron beam (EB) technology and the impact it is having on the printing, packaging, and converting industries. It will cover the financial, sustainability and safety ramifications of using EB technology, including examples of how today’s packagers, materials developers and press manufacturers are adopting their business models to accommodate EB use.

Albert Lin, Technical Director of ACTEGA Kelstar, will lead a session on food packaging safety and the ever-changing regulations around the globe. Citing the stringent demands that have emerged from food companies like Nestlé to restrict the materials used in their packages, Lin will discuss the key factors that are shaping the packaging of tomorrow, as well as the challenges facing radiation-curing chemistry, and EB specifically, when developing and implementing food packaging innovations.

This seminar, hosted by BroadBeam^™ EB system manufacturer PCT Engineered Systems, will feature a number of industry leaders presenting insight on a variety of EB-related package printing topics, including: recent EB innovations that are changing package converting; food safety regulations and principles applicable to the packaging industry; sustainable benefits of EB curing in food packaging; EB printing press design considerations; ink manufacturers' perspectives on using EB inks; and a case study of a  BroadBeam customer implementing EB.

The seminar will be offered regionally, in:  Milwaukee, September 16, 2014; Atlanta, November 11, 2014; and Newark, NJ, January 13, 2015.

For additional information, e-mail John Salkeld at jesalkeld@teampct.com.