This partnership will expand Bowman’s presence in Japan, making its XRF systems more accessible to a broader range of industries. With Bowman, Nireco will further grow its business in the semiconductor, electronic component, and PCB sectors.

The semiconductor industry is nearing the limits of circuit miniaturization, driving efforts to improve performance through multilayer integration. The development of next-generation package substrates, which will replace the resin substrates currently used for semiconductor packages, is a cutting-edge technology advancing in Japan and beyond. Accurate inspection of multilayered circuit pattern film thickness is crucial for these substrates. Bowman’s XRF measurement systems, featuring a high-resolution solid-state detector and micro-focus X-ray tube, are designed to precisely measure ultra-thin films, multilayer coatings, and compositions. This capability is ideal for use in R&D, production, and quality inspection of next-generation semiconductor packages, PCBs, and electronic components. Bowman XRF systems can be used as standalone instruments or integrated into automated production lines, offering unmatched versatility and accuracy.

For more information about Bowman Analytics and Nireco, visit www.bowmanxrf.com and https://nireco.com/en/.