American Packaging Expands EB Coating Capabilities for Tea Packaging
Need to Know
- American Packaging Corporation invested in electron-beam coating technology and precision slitting equipment for flexible tea packaging.
- The company says its EB coatings provide high gloss, controlled coefficient of friction and scuff resistance without solvents or emissions that could affect product aroma.
- The technology can be used with paper, foil, metallized films and other flexible-packaging substrates.
American Packaging Corporation has expanded its flexible-packaging capabilities with investments in electron-beam coating technology and precision slitting equipment for tea packaging.
The company said its EB coatings provide high gloss, controlled coefficient of friction and resistance to scuffing. According to APC, the coatings do not use solvents or produce emissions that could interfere with the aroma or flavor profile of packaged tea.
The investment also includes fixed-blade-width slitters designed to provide tight slit tolerances and uniform roll profiles. Automated handling moves material from the master roll through pallet preparation, which APC said can support greater consistency and efficiency on high-speed filling lines.
APC’s converting operations support flexographic, rotogravure and digital printing, along with extrusion and adhesive laminating. The company works with paper, foil, metallized films and other substrates to develop packaging structures based on barrier, surface-finish and production-line requirements.
The company said the combined coating, printing, laminating and slitting capabilities are intended to support freshness and aroma protection, print and finish quality and reliable filling-line performance.
APC did not disclose the investment amount, the locations receiving the equipment or the resulting change in production capacity.
The investment is relevant to coatings manufacturers following UV/EB curing equipment because it combines low-emission processing with controlled surface properties and high-speed converting requirements.
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