Fast-Cure Epoxy Hardener Targets Electronics and Encapsulation
Pflaumer Brothers has introduced TERAMINE 914SF, a modified aliphatic amine curing agent for fast-setting epoxy systems used in electronics, potting, encapsulation and structural adhesive applications.
The hardener is designed for use with bisphenol A and bisphenol F epoxy resins and cures at ambient temperature. Pflaumer reports a gel time of approximately eight minutes at 25 °C, along with rapid hardness development, low viscosity, low color, adhesion and mechanical performance.
The company recommends a use level of 50 phr with a standard bisphenol A epoxy resin with an epoxy equivalent weight of 190.
TERAMINE 914SF is formulated without benzyl alcohol or nonylphenol, providing an option for formulators developing systems in which those materials are not desired.
Pflaumer said the product is intended for professional and industrial applications and should be evaluated through laboratory and field testing to determine appropriate formulation and processing conditions.
View product details from Pflaumer Brothers.
Fast-curing amine chemistry gives formulators another option for balancing cure speed, adhesion, viscosity and mechanical performance in epoxy systems.
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