HyPox CTBN-modified epoxy resins improve cathodic disbondment and toughness properties at various temperatures when used in girth weld and in FBE coatings.
Following Univar's acquisition of Nexeo, Olin and the new Univar Solutions have signed a long-term distribution agreement for Olin's full portfolio of epoxy standard and specialty resins in all 50 U.S. states.
New waterborne epoxy resins and amine curing agents offer traditional epoxy performance while meeting the market’s desire for higher performance, lower cost and lower solvent content.
EPICLON HP 4770 is a multi-functional naphthalene epoxy resin for formulators in the aerospace, transportation and electronics industries who seek to increase high-temperature performance.
Semiconductor packaging assemblies require immense durability to protect the finished device from heat, physical impact, warping, static electricity and moisture. Therefore, formulators of epoxy compounds for semiconductor packaging assemblies require epoxy resins that deliver multiple performance characteristics that are dependent upon the requirements of the application or location of the finished device.
This novel water-based epoxy system, which offers comparable performance to traditional solventborne epoxy/polyamide systems, can also be applied on civil engineering concrete substrates, and has a lower applied cost.
BASF and Gustav Grolman GmbH & Co. KG have strengthened their exclusive collaboration in Europe in the marketing of amine-based curing agents for the processing of epoxy resins, with immediate effect.
