Semiconductor packaging assemblies require immense durability to protect the finished device from heat, physical impact, warping, static electricity and moisture. Therefore, formulators of epoxy compounds for semiconductor packaging assemblies require epoxy resins that deliver multiple performance characteristics that are dependent upon the requirements of the application or location of the finished device.
This novel water-based epoxy system, which offers comparable performance to traditional solventborne epoxy/polyamide systems, can also be applied on civil engineering concrete substrates, and has a lower applied cost.
BASF and Gustav Grolman GmbH & Co. KG have strengthened their exclusive collaboration in Europe in the marketing of amine-based curing agents for the processing of epoxy resins, with immediate effect.
Epoxy powder coatings are used in a variety of applications, and whether the coating is decorative, functional or both, a coating’s properties are critical.
The silicone-epoxy hybrid resin technology combines the positive effects of an aliphatic epoxy resin, like corrosion protection and chemical resistance, with the UV resistance and low yellowing characteristics of an alkoxy silicone resin.
MAINCOTE™ AEH acrylic epoxy hybrid combines the weatherability and UV resistance of acrylics with the chemical resistance of epoxies for two-component concrete coatings.
