For thermal-interface applications between a chip and heat spreader, Dow is highlighting silicone materials designed to provide high thermal conductivity, thin bond lines and stable coverage while withstanding stress and warpage during thermal cycling.

Dow’s MEMS and sensor-packaging materials are formulated without intentionally added per- and polyfluoroalkyl substances. The company said the materials are intended to provide device protection and long-term reliability while supporting customer materials-compliance objectives. The statement applies specifically to the identified MEMS and sensor materials, not to every technology in the showcased portfolio.

Silicone optical materials are being presented for bonding, encapsulation and protection in optical modules, fiber arrays and precision optical components. Dow is also highlighting silicone hot-melt technology for lamination and molding processes used in wafer- and panel-level packaging.

The company’s Cooling Science Studios in Shanghai and Auburn, Michigan, support material screening, application testing and process-development work using representative package structures and operating conditions.

Dow cautions that the information is not a product specification and that customers should confirm performance through their own testing. The announcement is an event and technology showcase rather than the launch of one new product.

Learn more about the silicone materials being presented for advanced semiconductor packaging.

The technologies are relevant to PCI readers following special-purpose coatings, encapsulation and protective materials used in electronics manufacturing.