Pira International and RadTech Europe have agreed to work together on a new market study named “The Future of Radiation Curing for Packaging.”
LEATHERHEAD, UK – Pira International and RadTech Europe have agreed to work together on a new market study named “The Future of Radiation Curing for Packaging.”
The study will provide quantitative market sizes for each key material, end-use, region and country. Using extensive primary research, the study will forecast to 2016. In addition, the study will contain important chapters on technology innovations and forecasts, key drivers, and hot topics such as sustainability.
Pira International will do the research for the study. RadTech Europe, the European Association for the Advancement of Radiation Curing by UV, EB and Laser Beams, will assist with the marketing and promotion of the market study. The final publication date for the study is the summer of 2011. For additional information, e-mail firstname.lastname@example.org.
RadTech Europe and Pira International Collaborate on Market Study
March 1, 2011