Paint and Coating Resins & Polymers

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Although CBPC coatings are relatively new in mine, quarry and aggregate processing applications, their use will only grow as word spreads about how they can inhibit carbon steel hopper and structural corrosion for decades as well as reduce premature maintenance and replacement.

Binders that show a high contact angle both before and after the salt spray test perform better for corrosion protection, compared to those that show low contact angles before and after the test.

Greater awareness of phenomena that occur on a nanometric scale and subsequent testing (both in application and synthesis of polymers) have led to the development of new materials with better performance characteristics than the traditional ones, with full respect for the environment.

Kevin Biller combines his love of food and cooking with his years of knowledge in researching, developing and testing powder coatings.

The adhesion/corrosion balance of the previous study yielded significant new insights into resin design. Polymers with good wet adhesion and good corrosion resistance could be isolated, and those properties correlated back to their monomer compositions and particle morphologies.

Semiconductor packaging assemblies require immense durability to protect the finished device from heat, physical impact, warping, static electricity and moisture. Therefore, formulators of epoxy compounds for semiconductor packaging assemblies require epoxy resins that deliver multiple performance characteristics that are dependent upon the requirements of the application or location of the finished device.

Newly designed low-viscosity oligomers allow the formulation of UV-curable soft-touch coatings without the need for solvent or water diluents.

The present study shows that the reactive diluent Tolonate X FLO 100, used in blend with conventional HDI-based polyisocyanates, can bring significant advantages to 2K polyaspartic systems.

The metal packaging industry demands a high-performing coating with a food safety profile desirable to consumers, which not only avoids BPA, but also other materials of concern such as epoxy, styrene or phenolic crosslinkers.

Adding formaldehyde-free alternatives to the encapsulation arsenal will be beneficial for many manufacturers, especially those creating products used directly by consumers or in building materials used in residential or office buildings.