Paint and Coating Resins & Polymers

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The improved adhesion, good corrosion resistance and good QUV gloss retention show that the hydrophobic resin in the hybrid polymer can be used to reduce the effects of high acid on corrosion and of styrene on QUV gloss retention.

One of the appropriate markets for recycling condensation polymers (polyester, polycarbonate, polyamide) is the coatings, adhesives, sealants and elastomers market (CASE), where many of the useful components for high performance already rely on varying levels of condensation polymers.

UV LED cure is becoming more and more prevalent in several converting areas. UV-curable inkjet has used UV LED cure for pinning for many years. Acrylated amines can be used to either increase UV LED cure speed at existing PI concentrations, or maintain UV LED cure speed at reduced PI concentrations. 

In this research, newly designed multifunctional polyol systems based on a polycarbonate structure and advanced polyisocyanate systems as crosslinkers were investigated in order to improve chemical resistance of coatings.

Although CBPC coatings are relatively new in mine, quarry and aggregate processing applications, their use will only grow as word spreads about how they can inhibit carbon steel hopper and structural corrosion for decades as well as reduce premature maintenance and replacement.

Binders that show a high contact angle both before and after the salt spray test perform better for corrosion protection, compared to those that show low contact angles before and after the test.

Greater awareness of phenomena that occur on a nanometric scale and subsequent testing (both in application and synthesis of polymers) have led to the development of new materials with better performance characteristics than the traditional ones, with full respect for the environment.

Kevin Biller combines his love of food and cooking with his years of knowledge in researching, developing and testing powder coatings.

The adhesion/corrosion balance of the previous study yielded significant new insights into resin design. Polymers with good wet adhesion and good corrosion resistance could be isolated, and those properties correlated back to their monomer compositions and particle morphologies.

Semiconductor packaging assemblies require immense durability to protect the finished device from heat, physical impact, warping, static electricity and moisture. Therefore, formulators of epoxy compounds for semiconductor packaging assemblies require epoxy resins that deliver multiple performance characteristics that are dependent upon the requirements of the application or location of the finished device.